Black film
It can be applied to super-thin (≧0.21mm) and large-size substrates (≦12”) high-absorbing film/black coating (Black Coating), or used on ultra-thin flexible substrates (≧0.02mm), which can absorb 99~99.95% The incident light range includes ultraviolet light, visible light to infrared light.
Compared with traditional black paint, it has lower thickness (micron->nano-level) and surface reflection, higher hardness (≧9H), adhesion (≧5B) and ring test resistance.
Products can be directly integrated into optical lens assembly/semiconductor packaging production lines, such as WLP (Wafer level package). It is currently used in mobile phones, vehicles, security control, AR/VR, etc. The introduction of black film for optical components can greatly reduce noise caused by stray light and crosstalk, greatly improve component performance, improve imaging quality, detection distance, etc., and Improve appearance and texture.
The patterning process can be carried out simultaneously, and combined with other functional films, such as anti-reflection film (GC-BBAR), filter film (Filter), etc., to better improve device performance.
Wafer-level optical coatings can be provided: the product surface quality of the semiconductor mature process level, and the ability to resist chemical cleaning is enhanced.
GCSOL can quickly provide customized production for various applications through its own optical design and manufacturing platform. It only needs to put forward the target specifications or requirements, and can quickly simulate, sample and modify according to customer feedback. In the mass production stage, Strict quality management system protects the rights and interests of customers.
GCSOL focuses on optical design and coating foundry. The development process attaches great importance to customer confidentiality, and it does not involve terminal component products that compete with customers.

Swipe the table right| Use band range | VIS / UV-VIS-NIR | surface quality | 10/5 (MIL-PRF-13830B) or Semi level |
|---|---|---|---|
| Application field | CIS, Lens, AR/VR, Automotive | Marginal zone | ≦2mm |
| Substrate material | Glass, Si or else | warping | <1mm |
| Substrate range (round) | ≦Φ300mm | Adhesion (Bag test) | Pass ISO Class#0 & ASTM Class#5B |
| Substrate range (square) | ≦350*350mm | hardness | JISK5600, Pencil: ≧9H, Weight: 750g |
| Substrate Thickness Range | 0.1~1.1mm | reliability test | 85℃ 85% : ≧1000 / 1500 hr |









